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<title><![CDATA[PEMBUATAN DAN PENGUJIAN WATERBLOK UNTUK SISTEM PENDING IN PROSESSOR AMD]]></title>
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<namePart>Ir. Agus Hermanto, M.T.</namePart>
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<namePart>RICHARD FERDINAND HASIBUAN / 122003167</namePart>
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<dateIssued><![CDATA[2006]]></dateIssued>
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<note>Today 's processors are cooled in three main ways; air-cooled, water-cooled, and vapor-compression cycle cooled, listed in order from most common to least common and least efficient to most efficient. All pre-assembled complete systems come air-cooled with a straight fin arrangement and a fan to remove heat generated by the CPU The heat generated by the CPU is transmitted through, by conduction, the heat sink and to the air by convection; a fan installed on the top of the heat sink increases the heat removal. Heat sinks are usually constructed of extruded, inexpensive aluminum for ease of manufacture and more efficient and expensive ones are fabricated with copper in a pin fin arrangement. Faster processors will generate more heat and the knowledge and ability to implement and efficiently cool the processor will be a great tool to reach a desired over clocked speed. The main objective of our design project is to design a water block that will outperform some of the top rated name brand water blocks. With the design of the water block, we hope to build and implement a reliable, cost effective and leak free water-cooled system by applying engineering principles. The CPU will be using is an AMD Duron, socket A, with a target temperature of at least 40°C to reach at least a 50% overclocked system bus. With testing we will reach the coldest temperature achievable through the material and the configuration of the system.</note>
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